Finite Element Simulation of Bonding Properties for Ti, TiN Films on 316L Stainless Steel Based on Nanoindentation Experiments

The modulus, hardness and indentation load-displacement curves of 316L stainless steel substrate, Ti film and TiN film were obtained by nanoindentation tests. The bilinear stress and strain relation of above materials was deduced by ANSYS finite element simulation and dimensional analysis, and then the corresponding indentation load-displacement curves obtained by computation and the bonding property of these two films/substrate systerms were analysed by the model. The results show that the identation load-displacement curves from computation were agreement well with that from nanoindentation tests. It was qulitatively indicated that the bonding property between TiN film and substrate was better than that between Ti film and substrate, which fitted the stratch test result well, proving the validity of the proposed method.