Microstructure and Properties of New As Annealed Cu/BMn40-1.5/Cu Elastic Material Prepared by Rolling Compound
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Abstract
A new Cu/BMn40-1.5/Cu elastic material was prepared by rolling compound method.The effect of the annealing temperature on microstructure and properties of the material was studied by microstructure observation,electric conductivity test and elastic modulus test.The results show that the Cu/BMn40-1.5/Cu elastic material with thickness of 0.2 mm could be prepared by taking proper rolling process.The bonding between the core material and the copper layer was good.After annealing for 2 h at different temperatures the electric conductivity of the Cu/BMn40-1.5/Cu elastic material increased first,that a peak value of 4.23×107 Ω-1·m-1 could be obtained when the annealing temperature was 400 ℃,and then decreased with the increase of annealing temperature.Annealing process had little effect on the elastic modulus of the elastic material.
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