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XIANG Fa-wu, LI Shu-lin, SHI Xiao-peng, YANG Zhe, ZHANG Tie-jun. Finite Element Analysis of Carrying Capacity of the Adhesive Bonding Repaired Composite[J]. Materials and Mechanical Engineering, 2012, 36(8): 101-104.
Citation: XIANG Fa-wu, LI Shu-lin, SHI Xiao-peng, YANG Zhe, ZHANG Tie-jun. Finite Element Analysis of Carrying Capacity of the Adhesive Bonding Repaired Composite[J]. Materials and Mechanical Engineering, 2012, 36(8): 101-104.

Finite Element Analysis of Carrying Capacity of the Adhesive Bonding Repaired Composite

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  • Received Date: April 18, 2012
  • The adhesive bonding repairing technology was used to repair the damage of the composite material components, and the tensile test was carried out on the MTS equipment to record the maximal loads that the components can endure under the different way. The intensity of repaired components was simulated through finite element software of Abaqus to calculate the maximum of load which was compared with the experimental data. The results show that the data of the simulation and experimentation were similar with the deviation less than 10%, which proved that the simulation model and the compute method were up to the mustard of engineering; The best repairing parameters were gained as following: the direction of the repairing patch and motherboard was vertical; the patch was 2-3 times the size of the damage area; the ratio of patch thickness and damage depth was 0.6-0.75.
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