Rolling Cladding Technology of Cu/Mo/Cu Electronic Packaging Material

Cu/Mo/Cu cladding plates were prepared by different rolling cladding technologies.The effects of the first pressing ratio and annealing temperature on bonding strength and thermal conductivity of the cladding plates were analyzed by means of ultrasonic detector and universal testing machine.The rolling cladding technology was obtained.The results indicate that the best process was first pressing ratio 60%,annealing temperature 700℃ and holding time 60 min.The interface bonding strength reached 80 N·mm-1 and thermal conductivity in thickness direction was 210 W·m-1·K-1.